The ADC12QJ1600-SEP is a radiation-tolerant device in an organic flip-chip package that is designed for space applications. The 10 × 10mm 144ALR package utilizes eutectic tin-lead (SnPb) die-bumps and external SnPb BGA balls. The device was verified as single event latch-up (SEL) immune to 43MeV × cm²/ mg at a junction temperature of 125°C. The ADC12QJ1600-SEP is manufactured with TI's internal 65nm CMOS C021.A process.

Each fabrication lot is tested according to the MIL-STD-883 requirements for Radiation Lot Acceptance Testing (RLAT) up to 30krad(Si) and each assembly and test lot follows the process flow shown in Figure 2-1. To verify the quality of ADC12QJ1600-SEP, the device has been tested and qualified to meet space-grade requirements for VLEO, LEO, and MEO missions. See Section 3 for further details.