SBAS350H June   2005  – June 2025 ADS1232 , ADS1234

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Noise Performance
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Inputs (AINPX, AINNX)
      2. 7.3.2  Temperature Sensor (ADS1232 Only)
      3. 7.3.3  Low-Noise PGA
        1. 7.3.3.1 PGA Bypass Capacitor
      4. 7.3.4  Voltage Reference Inputs (REFP, REFN)
      5. 7.3.5  Clock Sources
      6. 7.3.6  Digital Filter Frequency Response
      7. 7.3.7  Settling Time
      8. 7.3.8  Data Rate
      9. 7.3.9  Data Format
      10. 7.3.10 Data Ready and Data Output (DRDY/DOUT)
      11. 7.3.11 Serial Clock Input (SCLK)
      12. 7.3.12 Data Retrieval
    4. 7.4 Device Functional Modes
      1. 7.4.1 Offset Calibration Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Standby Mode With Offset-Calibration
      4. 7.4.4 Power-Down Mode
      5. 7.4.5 Power-Up Sequence
      6. 7.4.6 Summary of Serial Interface Waveforms
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) ADS1232 ADS1234 UNIT
PW (TSSOP) PW (TSSOP)
24 PINS 28 PINS
RθJA Junction-to-ambient thermal resistance 82.4 74.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 25.5 21.9 °C/W
RθJB Junction-to-board thermal resistance 38.1 32.9 °C/W
ψJT Junction-to-top characterization parameter 1.3 1.1 °C/W
ψJB Junction-to-board characterization parameter 37.6 32.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.