SBASAI5C May   2023  – August 2025 TMAG5253

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Magnetic Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Sensitivity Linearity
    2. 7.2 Ratiometric Architecture
    3. 7.3 Sensitivity Temperature Compensation
    4. 7.4 Quiescent Voltage Temperature Drift
    5. 7.5 Power-On Time
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Magnetic Flux Direction
      2. 8.3.2 Hall Element Location
      3. 8.3.3 Magnetic Response
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Selecting the Sensitivity Option
      2. 9.1.2 Temperature Compensation for Magnets
      3. 9.1.3 Adding a Low-Pass Filter
      4. 9.1.4 Designing With Multiple Sensors
      5. 9.1.5 Duty-Cycled, Low-Power Design
    2. 9.2 Typical Applications
      1. 9.2.1 Slide-By Displacement Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Head-On Displacement Sensing
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Remote-Sensing Applications
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TMAG5253 UNIT
DMR(X2SON)
4 PINS
RθJA Junction-to-ambient thermal resistance 157.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 110.9 °C/W
RθJB Junction-to-board thermal resistance 105 °C/W
YJT Junction-to-top characterization parameter 2.4 °C/W
YJB Junction-to-board characterization parameter 101.9 °C/W
RθJC(bot) Junction-to-board (bottom) thermal resistance 85.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.