SBASAP6 February   2025 ADC3683-EP , ADC3683-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - Power Consumption
    6. 5.6 Electrical Characteristics - DC Specifications
    7. 5.7 Electrical Characteristics - AC Specifications
    8. 5.8 Timing Requirements
    9. 5.9 Typical Characteristics - ADC3683
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
        1. 7.3.1.1 Analog Input Bandwidth
        2. 7.3.1.2 Analog Front End Design
          1. 7.3.1.2.1 Sampling Glitch Filter Design
          2. 7.3.1.2.2 Analog Input Termination and DC Bias
            1. 7.3.1.2.2.1 AC-Coupling
            2. 7.3.1.2.2.2 DC-Coupling
        3. 7.3.1.3 Auto-Zero Feature
      2. 7.3.2 Clock Input
        1. 7.3.2.1 Single Ended vs Differential Clock Input
        2. 7.3.2.2 Signal Acquisition Time Adjust
      3. 7.3.3 Voltage Reference
        1. 7.3.3.1 Internal voltage reference
        2. 7.3.3.2 External voltage reference (VREF)
        3. 7.3.3.3 External voltage reference with internal buffer (REFBUF/CTRL)
      4. 7.3.4 Digital Down Converter
        1. 7.3.4.1 DDC MUX
        2. 7.3.4.2 Digital Filter Operation
        3. 7.3.4.3 FS/4 Mixing with Real Output
        4. 7.3.4.4 Numerically Controlled Oscillator (NCO) and Digital Mixer
        5. 7.3.4.5 Decimation Filter
        6. 7.3.4.6 SYNC
        7. 7.3.4.7 Output Formatting with Decimation
      5. 7.3.5 Digital Data Path and Interface
        1. 7.3.5.1 Data Path Overview
        2. 7.3.5.2 Output Scrambler
        3. 7.3.5.3 Output Bit Mapper
          1. 7.3.5.3.1 2-Wire Mode
          2. 7.3.5.3.2 1-Wire Mode
          3. 7.3.5.3.3 ½-Wire Mode
        4. 7.3.5.4 Device Configuration Steps
          1. 7.3.5.4.1 Configuration Example
        5. 7.3.5.5 Output Data Format
      6. 7.3.6 Test Pattern
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Power Down Options
      3. 7.4.3 Digital Channel Averaging
    5. 7.5 Programming
      1. 7.5.1 Configuration using PINs only
      2. 7.5.2 Configuration using the SPI interface
        1. 7.5.2.1 Register Write
        2. 7.5.2.2 Register Read
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Signal Path
        2. 8.2.2.2 Sampling Clock
        3. 8.2.2.3 Voltage Reference
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up
      1. 8.3.1 Register Initialization During Operation
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Register Map
    1. 9.1 Detailed Register Description
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

1 Features

  • Radiation tolerant (-SEP only):
    • Single-event latch-up (SEL) immune up to LET = 43 MeV-cm2/mg
    • Single-event functional interrupt (SEFI) characterized up to LET = 43 MeV-cm2/mg
    • Total ionizing dose (TID): 30 krad(Si)
  • Enhanced product (-EP and -SEP):
    • Meets ASTM E595 outgassing specification
    • Vendor item drawing (VID)
    • Temperature range: –55°C to 105°C
    • One fabrication, assembly, and test site
    • Gold bond wire, NiPdAu lead finish
    • Wafer lot traceability
    • Extended product life cycle
  • Dual channel, 65 MSPS ADC
  • 18-bit resolution (no missing codes)
  • Noise floor: -160 dBFS/Hz
  • Low power 94 mW/ch (at 65MSPS)
  • Latency: 1-2 clock cycles
  • INL: ±7, DNL: ±0.7 LSB (typical)
  • Reference options: external or internal
  • On-chip DSP (optional/bypassable)
    • Decimation by 2, 4, 8, 16, 32
    • 32-bit NCO
  • Serial LVDS digital interface (2-, 1- and 1/2-wire)
  • Small footprint: 40-QFN (5x5 mm) package
  • Spectral performance (fIN = 5MHz):
    • SNR: 83.8dBFS
    • SFDR: 89dBc HD2, HD3
    • SFDR: 101dBFS Worst spur