SBASB32 December   2025 AMC0303M0510

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information (D Package)
    5. 6.5  Thermal Information (DWV Package)
    6. 6.6  Power Ratings 
    7. 6.7  Insulation Specifications (Basic Isolation)
    8. 6.8  Insulation Specifications (Reinforced Isolation)
    9. 6.9  Safety-Related Certifications (Basic Isolation)
    10. 6.10 Safety-Related Certifications (Reinforced Isolation)
    11. 6.11 Safety Limiting Values (D Package)
    12. 6.12 Safety Limiting Values (DWV Package)
    13. 6.13 Electrical Characteristics
    14. 6.14 Switching Characteristics
    15. 6.15 Timing Diagrams
    16. 6.16 Insulation Characteristics Curves
    17. 6.17 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Modulator
      3. 7.3.3 Isolation Channel Signal Transmission
      4. 7.3.4 Digital Output
        1. 7.3.4.1 Output Behavior in Case of a Full-Scale Input
        2. 7.3.4.2 Output Behavior in Case of a Missing High-Side Supply
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Filter Design
        2. 8.2.2.2 Bitstream Filtering
      3. 8.2.3 Application Curve
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

6.14 Switching Characteristics

over operating ambient temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fCLK Internal clock frequency 9.4 10 10.6 MHz
dCLK Internal clock duty cycle dCLK = tHIGH / tCLK, tCLK = 1/fCLK 45% 50% 55%
tH DOUT hold time after rising edge of CLKOUT CLOAD = 15pF 7 ns
tD DOUT delay time after rising edge of CLKOUT CLOAD = 15pF 16 ns
tr DOUT and CLKOUT rise time 10% to 90%, 2.7V ≤ DVDD ≤ 3.6V, CLOAD = 15 pF 2.5 6 ns
10% to 90%, 4.5V ≤ DVDD ≤ 5.5V, CLOAD = 15 pF 3.0 6
tf DOUT and CLKOUT fall time 10% to 90%, 2.7V ≤ DVDD ≤ 3.6V, CLOAD = 15 pF 2.7 6 ns
10% to 90%, 4.5V ≤ DVDD ≤ 5.5V, CLOAD = 15 pF 3.3 6
tSTART Device start-up time AVDD step from 0  to 3.0V with DVDD ≥ 2.7V to bitstream valid, 0.1% settling 100 µs