SBASB99 November   2025 AMC1200C

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information (DWV Package)
    5. 5.5  Thermal Information (DUB Package)
    6. 5.6  Power Ratings
    7. 5.7  Insulation Specifications
    8. 5.8  Safety-Related Certifications
    9. 5.9  Safety Limiting Values (DWV Package)
    10. 5.10 Safety Limiting Values (DUB Package)
    11. 5.11 Electrical Characteristics
    12. 5.12 Switching Characteristics
    13. 5.13 Timing Diagram
    14. 5.14 Insulation Characteristics Curves
    15. 5.15 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Isolation Channel Signal Transmission
      3. 6.3.3 Analog Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Filter Design
        2. 7.2.2.2 Differential-to-Single-Ended Output Conversion
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7.2.2 Detailed Design Procedure

In the Typical Application figure, the high-side power supply (VDD1) for the AMC1200C is derived from the floating power supply of the upper gate driver.

The floating ground reference (GND1) is derived from the end of the shunt resistor that is connected to the negative input of the AMC1200C (INN). If a four-pin shunt is used, the inputs of the AMC1200C are connected to the inner leads. GND1 is then connected to the outer lead on the INN-side of the shunt. To minimize offset and improve accuracy, route the ground connection as a separate trace that connects directly to the shunt resistor. Do not short GND1 to INN directly at the device input; see the Layout Example section for more details.

Use Ohm's Law to calculate the voltage drop across the shunt resistor (VSHUNT) for the desired measured current:

Equation 2. VSHUNT = I × RSHUNT

Select a RSHUNT value to satisfy the following two conditions:

  • First, the voltage drop caused by the nominal current range does not exceed the recommended differential input voltage range of VSHUNT ≤ ±250mV.
  • Secondly, the voltage drop caused by the maximum allowed overcurrent does not exceed the input voltage that causes a clipping output. Keep VSHUNT ≤ VClipping.