Abstract

This document serves to accompany the design files for the HEADON-MAG-ACC attachment for the magnetic sensing evaluation kits (EVMs) that interface with the TI-SCB such as the TMAG5273EVM and the TMAG5170EVM. In addition to this guide, the design files are provided as an example and may be used in a 3D printer to generate a demonstration of head-on linear displacement function, where fastening the screw portion of the attachment into the base portion of the attachment decreases the linear displacement between the attachment’s magnet and the Hall sensor underneath it.