SBOS069A October   1997  – December 2024 INA122

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Setting the Gain
      2. 6.3.2 Input Common-Mode Range
      3. 6.3.3 Input Protection
      4. 6.3.4 Output Current Range
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Offset Trimming
      2. 7.1.2 Input Bias Current Return Path
    2. 7.2 Typical Application
      1. 7.2.1 Resistive-Bridge Pressure Sensor
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
        2. 8.1.1.2 TINA-TI (Free Software Download)
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.3 Thermal Information

THERMAL METRIC(1) INA122 UNIT
D (SOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 129.2 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 69.1 ℃/W
RθJB Junction-to-board thermal resistance 76.8 ℃/W
ψJT Junction-to-top characterization parameter 16.1 ℃/W
ψJB Junction-to-board characterization parameter 75.8 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.