SBOS301C May   2004  – December 2025 LOG114

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (±5V)
    6. 5.6 Electrical Characteristics (5V)
    7. 5.7 Typical Characteristics: VS = ±5V
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Logarithmic and Difference Amplifier
      2. 6.3.2 COM Voltage Range
      3. 6.3.3 VCM IN
      4. 6.3.4 Auxiliary Operational Amplifier
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Applications Information
      1. 7.1.1 Transfer Function
      2. 7.1.2 Input Current Range
      3. 7.1.3 Setting the Reference Current
      4. 7.1.4 Negative Input Currents
      5. 7.1.5 Voltage Inputs
      6. 7.1.6 High-Current Linearity Correction
      7. 7.1.7 Error Sources
        1. 7.1.7.1 Accuracy
        2. 7.1.7.2 Total Error
        3. 7.1.7.3 Errors RTO and RTI
        4. 7.1.7.4 Log Conformity
        5. 7.1.7.5 Individual Error Components
    2. 7.2 Typical Applications
      1. 7.2.1 Design Example for Dual-Supply Configuration
      2. 7.2.2 Design Example for Single-Supply Configuration
      3. 7.2.3 Advantages of Dual−Supply Operation
      4. 7.2.4 Log Ratio
      5. 7.2.5 Data Compression
      6. 7.2.6 3.3V Operation
      7. 7.2.7 Erbium-Doped Fiber Optic Amplifier (EDFA)
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
      2. 8.2.2 PSpice® for TI
      3. 8.2.3 TINA-TI™ (Free Software Download)
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5 Specifications

Note:

TI has qualified multiple fabrication flows for this device. Differences in performance are labeled by chip site origin (CSO). For system robustness, designing for all flows is highly recommended. For more information, please see Section 8.1.1.