SBOS301C May   2004  – December 2025 LOG114

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (±5V)
    6. 5.6 Electrical Characteristics (5V)
    7. 5.7 Typical Characteristics: VS = ±5V
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Logarithmic and Difference Amplifier
      2. 6.3.2 COM Voltage Range
      3. 6.3.3 VCM IN
      4. 6.3.4 Auxiliary Operational Amplifier
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Applications Information
      1. 7.1.1 Transfer Function
      2. 7.1.2 Input Current Range
      3. 7.1.3 Setting the Reference Current
      4. 7.1.4 Negative Input Currents
      5. 7.1.5 Voltage Inputs
      6. 7.1.6 High-Current Linearity Correction
      7. 7.1.7 Error Sources
        1. 7.1.7.1 Accuracy
        2. 7.1.7.2 Total Error
        3. 7.1.7.3 Errors RTO and RTI
        4. 7.1.7.4 Log Conformity
        5. 7.1.7.5 Individual Error Components
    2. 7.2 Typical Applications
      1. 7.2.1 Design Example for Dual-Supply Configuration
      2. 7.2.2 Design Example for Single-Supply Configuration
      3. 7.2.3 Advantages of Dual−Supply Operation
      4. 7.2.4 Log Ratio
      5. 7.2.5 Data Compression
      6. 7.2.6 3.3V Operation
      7. 7.2.7 Erbium-Doped Fiber Optic Amplifier (EDFA)
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
      2. 8.2.2 PSpice® for TI
      3. 8.2.3 TINA-TI™ (Free Software Download)
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) LOG114 UNIT
RGV (VQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance  46.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.9 °C/W
RθJB Junction-to-board thermal resistance 21.8 °C/W
ψJT Junction-to-top characterization parameter 1.1 °C/W
ψJB Junction-to-board characterization parameter 21.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.