SBOU277 November   2021 OPA2863A

 

  1.   Trademarks
  2. 1Features
  3. 2Power Connections
    1. 2.1 Split-Supply Operation
    2. 2.2 Single Supply Operation
  4. 3Input and Output Connections
  5. 4Schematic
  6. 5Layout

Layout

Figure 5-1 through Figure 5-4 show the respective PCB layers from top to bottom.

GUID-20211118-SS0I-5BKQ-ZCH2-LRHQ7VP242WK-low.pngFigure 5-1 DEM-OPA-DSN-EVM Top Layers
GUID-20211118-SS0I-1DKP-WXWD-Z8X5WCP86MFH-low.pngFigure 5-3 DEM-OPA-DSN-EVM Power Layer (Layer 3)
GUID-20211118-SS0I-GMFG-SV5W-4QKKFSMLQM8V-low.pngFigure 5-2 DEM-OPA-DSN-EVM Ground Layer (Layer 2)
GUID-20211118-SS0I-SW3V-3J41-BXC2SCNPW69V-low.pngFigure 5-4 DEM-OPA-DSN-EVM Bottom Layers