SBOU314A June   2024  – March 2025 TRF1305A2 , TRF1305B2 , TRF1305C2

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 General Usage Information
  7. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
      1. 3.2.1 Stack-Up and Material
    3. 3.3 EVM Bill of Material
  8. 4Additional Information
    1. 4.1 Trademarks
  9. 5Related Documentation

3.2.1 Stack-Up and Material

The EVM is a 67-mil, 4-layer board with material type Isola® 370HR. The top layer routes the power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground layer. The signal trace impedance is targeted at 50Ω. The bottom three layers are ground layers.

TRF1305A2-D2D-EVM, TRF1305B2-D2D-EVM, TRF1305C2-D2D-EVM EVM Stack-Up (Units in Mils)Figure 3-6 EVM Stack-Up (Units in Mils)