SCAS957A November   2023  – March 2024 SN74AC541-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
    4. 7.4 Feature Description
      1. 7.4.1 Balanced CMOS 3-State Outputs
      2. 7.4.2 Standard CMOS Inputs
      3. 7.4.3 Wettable Flanks
      4. 7.4.4 Clamp Diode Structure
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Design Requirements
      1. 8.3.1 Power Considerations
      2. 8.3.2 Input Considerations
      3. 8.3.3 Output Considerations
    4. 8.4 Detailed Design Procedure
    5. 8.5 Application Curve
    6. 8.6 Power Supply Recommendations
    7. 8.7 Layout
      1. 8.7.1 Layout Guidelines
      2. 8.7.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) DGS (VSSOP) PW (TSSOP) RKS (WQFN) UNIT
20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 123.5 126.2 72.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62.1 68.7 77.1 °C/W
RθJB Junction-to-board thermal resistance 78.5 77.3 45.6 °C/W
ΨJT Junction-to-top characterization parameter 7.8 22.3 13.2 °C/W
ΨJB Junction-to-board characterization parameter 78 76.9 45.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 29.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.