SCASE15B September   2024  – August 2025 SN74AC3G97

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6.     12
    7. 5.6 Switching Characteristics
    8. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
    5. 7.5 Combinatorial Logic Configurations
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
      4. 8.2.4 Power Supply Recommendations
      5. 8.2.5 Layout
        1. 8.2.5.1 Layout Guidelines
        2. 8.2.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

SN74AC3G97 SN74AC3G97 PW Package, 14-Pin TSSOP (Top View)Figure 4-1 SN74AC3G97 PW Package, 14-Pin TSSOP (Top View)
SN74AC3G97 SN74AC3G97 BQA Package, 14-Pin WQFN (Top View)Figure 4-2 SN74AC3G97 BQA Package, 14-Pin WQFN (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
A1 1

I

 Channel 1, input A
B1 2

I

 Channel 1, input B
A2 3

I

 Channel 2, input A
B2 4

I

 Channel 2, input B
A3 5

I

 Channel 3, input A
B3 6

I

 Channel 3, input B
GND 7

G

 Ground
Y3 8

O

 Channel 3, output Y
C3 9

I

 Channel 3, input C
Y2 10

O

 Channel 2, output Y
C2 11

I

 Channel 2, input C
Y1 12

O

 Channel 1, output Y
C1 13

I

 Channel 1, input C
VCC 14

P

 Positive supply
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
(1) I = input, O = output, I/O = input or output, G = ground, P = power.
(2) BQA package only.