SCASE86 April   2025 SN74ACT257-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 TTL-Compatible CMOS Inputs
      3. 7.3.3 Wettable Flanks
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

Figure 4-1 PW Package,16-Pin TSSOP(Top View)
Figure 4-2 BQB Package,16-Pin WQFN(Transparent Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
A/B 1 I Data select input for all channels
1A 2 I Channel 1, input A
1B 3 I Channel 1, input B
1Y 4 O Channel 1, output Y
2A 5 I Channel 2, input A
2B 6 I Channel 2, input B
2Y 7 O Channel 2, output Y
GND 8 G Ground
3Y 9 O Channel 3, output Y
3B 10 I Channel 3, input B
3A 11 I Channel 3, input A
4Y 12 O Channel 4, output Y
4B 13 I Channel 4, input B
4A 14 I Channel 4, input A
OE 15 I Output enable input for all channels, active low
VCC 16 P Positive supply
Thermal Pad(2) — The thermal pad can be connect to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, P = Power, G = Ground.
(2) BQB package only.