SCDS038N December   1997  – July 2026 SN74CBTLV3126

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - D, DGV, DBQ, PW, RGY
    6. 5.6 Electrical Characteristics - DYY and BQA
    7. 5.7 Switching Characteristics - D, DGV, DBQ, PW, RGY
    8. 5.8 Switching Characteristics - DYY and BQA
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Function Table (Each Bus Switch)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Protocol and Signal Isolation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SN74CBTLV3126 UNIT
D (SOIC) DGV (TVSOP) PW (TSSOP) RGY (VQFN) DBQ (SSOP) DYY (SOT) BQA (WQFN)
14 PINS 14 PINS 14 PINS 14 PINS 16 PINS 16 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 123.0 154.8 148.9 101.8 118.7 157.0 122.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 83.5 64.5 81.0 75.6 66.4 99.1 87.5 °C/W
RθJB Junction-to-board thermal resistance 81.1 88.4 105.1 41.6 62.2 95.8 32.6 °C/W
ΨJT Junction-to-top characterization parameter 39.7 11.1 23.0 74.9 20.9 30.6 87.6 °C/W
ΨJB Junction-to-board characterization parameter 80.5 87.4 103.8 103 61.7 95.5 110.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A 58.9 N/A N/A 54.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.