SCDS154C October   2003  – August 2026 SN74CB3Q3244

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Pin Configuration and Functions
  5. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics
    7. 4.7 Typical Characteristics
  6. 5Parameter Measurement Information
  7. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

4.4 Thermal Information

THERMAL METRIC(1) SN74CB3Q3244 UNIT
DBQ (SSOP) DB (SSOP) DW (SOIC) DGV (TVSOP) PW (TSSOP) RGY (VQFN)
20 PINS 20 PINS 20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 106.4 70 58 92 114.3 72.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application note.