SCDU018A December   2020  – December 2020

 

  1.   Abstract
  2.   Trademarks
  3. 1 Introduction
  4. 2 Information About Cautions and Warnings
  5. 3 Features of this EVM
  6. 4 EVM Images
  7. 5 EVM Setup
  8. 6 EVM Connectors and Test Points
    1. 6.1 Connectors
    2. 6.2 Test Points
  9. 7 PCB Layouts
  10. 8 Schematics
  11. 9 Bill of Materials
  12. 10Related Documentation
  13. 11Revision History

3 Features of this EVM

The EVM has the following features:

  • Quick prototyping and testing setup for the 16-pin TMUX7208 device in the TSSOP (PW) package.
  • TMUX7208 control logic truth table listed on board.
  • No specific TMUX7208 is supplied or soldered to the evaluation module. Allows flexibility to choose the desired IC for evaluation.
  • Support for both single supply and dual supply operation.
  • Six power supply decoupling capacitors (2 × 0.1 μF, 2 × 1 μF, and 2 × 10 μF).
  • Jumpers to nine signal lanes, VDD and VSS power rails, and control signals.
  • Nine pads are available for placement of SMA connectors.
  • Pads are available for pull-up or pull-down resistors on control signal pathways.
  • Pads are available for surge protection diodes.
  • 0805 capacitor pads are available on all signal pathways referenced to ground.