SCES792D November   2009  – May 2026 SN74AVC4T245-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics: VCCA = 1.2V
    7. 5.7  Switching Characteristics, VCCA = 1.5V ± 0.1V
    8. 5.8  Switching Characteristics: VCCA = 1.8V ± 0.15V
    9. 5.9  Switching Characteristics: VCCA = 2.5V ± 0.2V
    10. 5.10 Switching Characteristics: VCCA = 3.3V ± 0.3V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design
      2. 7.3.2 Supports High Speed Translation
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Pin Configuration and Functions

SN74AVC4T245-Q1 RGY Package 16-Pin VQFN
                        With Exposed Thermal Pad (Top View)Figure 4-1 RGY Package 16-Pin VQFN With Exposed Thermal Pad (Top View)
SN74AVC4T245-Q1 BQB/WBQB Package,
                        16-Pin WQFN
                        (Transparent Top View)Figure 4-3 BQB/WBQB Package, 16-Pin WQFN (Transparent Top View)
SN74AVC4T245-Q1 PW Package,
                        16-Pin TSSOP
                        (Top View)Figure 4-2 PW Package, 16-Pin TSSOP (Top View)
SN74AVC4T245-Q1 DYY Package,
                        16-Pin SOT
                        (Top View)Figure 4-4 DYY Package, 16-Pin SOT (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1A1 4 I/O Input/output 1A1. Referenced to VCCA.
1A2 5 I/O Input/output 1A2. Referenced to VCCA.
1B1 13 I/O Input/output 1B1. Referenced to VCCB.
1B2 12 I/O Input/output 1B2. Referenced to VCCB.
1DIR 2 I Direction-control input for 1 ports
1 OE 15 I 3-state output-mode enable. Pull OE high to place ‘1’ outputs in 3-state mode. Referenced to VCCA.
2A1 6 I/O Input/output 2A1. Referenced to VCCA.
2A2 7 I/O Input/output 2A2. Referenced to VCCA.
2B1 11 I/O Input/output 2B1. Referenced to VCCB.
2B2 10 I/O Input/output 2B2. Referenced to VCCB.
2DIR 3 I Direction-control input for 2 ports
2 OE 14 I 3-state output-mode enable. Pull OE high to place ‘2’ outputs in 3-state mode. Referenced to VCCA.
GND 8, 9 Ground
VCCA 1 I A-port power supply voltage. 1.2V ≤ VCCA ≤ 3.6V
VCCB 16 I B-port power supply voltage. 1.2V ≤ VCCB ≤ 3.6V
Thermal pad The exposed thermal pad must be connected as a secondary GND or be left electrically open.
I = input, O = output