SCHS306E January   2001  – November 2024 CD54AC05 , CD74AC05

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, VCC = 1.5 V
    7. 4.7 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    8. 4.8 Switching Characteristics, VCC = 5 V ± 0.5 V
    9. 4.9 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

3 Pin Configuration and Functions

CD54AC05 CD74AC05 CD54AC05 J Package, 14-Pin CDIP; CD74AC05 D, N, or PW Packages; 14-Pin SOIC, PDIP , or TSSOP (Top View)Figure 3-1 CD54AC05 J Package, 14-Pin CDIP; CD74AC05 D, N, or PW Packages; 14-Pin SOIC, PDIP , or TSSOP (Top View)
CD54AC05 CD74AC05 CD74AC05 BQA Package, 14-Pin WQFNFigure 3-2 CD74AC05 BQA Package, 14-Pin WQFN
Table 3-1 Pin Functions
PIN I/O(1) DESCRIPTION
NAME CD74AC05 CD54AC05
BQA, D, N, PW J
1A 1 1 I 1A Input
1Y 2 2 O 1Y Output
2A 3 3 I 2A Input
2Y 4 4 O 2Y Output
3A 5 5 I 3A Input
3Y 6 6 O 3Y Output
GND 7 7 — Ground Pin
4Y 8 8 O 4Y Output
4A 9 9 I 4A Input
5Y 10 10 I 5Y Output
5A 11 11 I 5A Input
6Y 12 12 O 6Y Output
6A 13 13 I 6A Input
VCC 14 14 — Power Pin
NC — — — No Connection
Thermal pad — Connect the GND pin to the exposed thermal pad for correct operation. Connect the thermal pad to any internal PCB ground plane using multiple vias for good thermal performance.
(1) I = input, O = output, P = power, FB = feedback, GND = ground, N/A = not applicable