SCLS175 Data sheet

SCLS175I March 2003 – February 2025 SN54HCT244 , SN54HCT244-SP , SN74HCT244

PRODUCTION DATA

5.4 Thermal Information

THERMAL METRIC		SN74HCT244						UNIT
		DW (SOIC)	DB (SSOP)	N (PDIP)	NS (SO)	PW (TSSOP)	DGS (VSSOP)
		20 PINS	20 PINS	20 PINS	20 PINS	20 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance^⁽¹⁾	109.1	122.7	84.6	113.4	131.8	130.6	°C/W
R_{θJC (top)}	Junction-to-case (top) thermal resistance	76	81.6	72.5	78.6	72.2	68.7	°C/W
R_θJB	Junction-to-board thermal resistance	77.6	77.5	65.3	78.4	82.8	85.4	°C/W
Ψ_JT	Junction-to-top characterization parameter	51.5	46.1	55.3	47.1	21.5	10.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	77.1	77.1	65.2	78.1	82.4	85.0	°C/W
R_{θJC (bot)}	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.