SCLS756F May   2019  – October 2026 SN74HCS08-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

SN74HCS08-Q1 D, PW, or DYY Package,14-Pin SOIC, TSSOP or SOT(Top View)Figure 4-1 D, PW, or DYY Package,
14-Pin SOIC, TSSOP or SOT
(Top View)
SN74HCS08-Q1 BQA Package,14-Pin WQFN(Top View)Figure 4-2 BQA Package,
14-Pin WQFN
(Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1A 1 I Channel 1, Input A
1B 2 I Channel 1, Input B
1Y 3 O Channel 1, Output Y
2A 4 I Channel 2, Input A
2B 5 I Channel 2, Input B
2Y 6 O Channel 2, Output Y
3A 9 I Channel 3, Input A
3B 10 I Channel 3, Input B
3Y 8 O Channel 3, Output Y
4A 12 I Channel 4, Input A
4B 13 I Channel 4, Input B
4Y 11 O Channel 4, Output Y
GND 7 — Ground
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
VCC 14 — Positive Supply
(1) I = input, O = output
(2) BQA Package only.