SCPS272C October   2019  – January 2021 TCA9511A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Hot bus insertion
      2. 8.3.2 Pre-charge voltage
      3. 8.3.3 Rise time accelerators
      4. 8.3.4 Bus ready output indicator
      5. 8.3.5 Powered-off high impedance for I2C and I/O pins
      6. 8.3.6 Supports clock stretching and arbitration
    4. 8.4 Device Functional Modes
      1. 8.4.1 Start-up and precharge
      2. 8.4.2 Bus idle
      3. 8.4.3 Bus active
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Series connections
        2. 9.2.1.2 Multiple connections to a common node
        3. 9.2.1.3 Propagation delays
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application on a Backplane
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Best Practices
    2. 10.2 Power-on Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TCA9511 UNIT
DGK
8 Pin
RθJA Junction-to-ambient thermal resistance 177.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 64.5 °C/W
RθJB Junction-to-board thermal resistance 99.6 °C/W
ΨJT Junction-to-top characterization parameter 9.5 °C/W
ΨJB Junction-to-board characterization parameter 97.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.