SFFS055 March   2021 SN65HVD1780 , SN65HVD1781 , SN65HVD1782

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

2 Functional Safety Failure In Time (FIT) Rates

This section provides Functional Safety Failure In Time (FIT) rates for SN65HVD1780, SN65HVD1781, and SN65HVD1782 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-4 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 for SN65HVD1780
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours) 8-pin SOIC (D) JEDEC high-K model FIT (Failures Per 109 Hours) 8-pin PDIP (P) JEDEC high-K model FIT (Failures Per 109 Hours) 8-pin SOIC (D) JEDEC low-K model FIT (Failures Per 109 Hours) 8-pin PDIP (P) JEDEC low-K model
Total Component FIT Rate 19 27 13 23
Die FIT Rate 10 5 5 3
Package FIT Rate 9 22 9 20
Table 2-2 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 for SN65HVD1781
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours) 8-pin SOIC (D) JEDEC high-K model FIT (Failures Per 109 Hours) 8-pin PDIP (P) JEDEC high-K model FIT (Failures Per 109 Hours) 8-pin SOIC (D) JEDEC low-K model FIT (Failures Per 109 Hours) 8-pin PDIP (P) JEDEC low-K model
Total Component FIT Rate 20 27 14 23
Die FIT Rate 11 5 6 3
Package FIT Rate 9 22 8 20
Table 2-3 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 for SN65HVD1782
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours) 8-pin SOIC (D) JEDEC high-K model FIT (Failures Per 109 Hours) 8-pin PDIP (P) JEDEC high-K model FIT (Failures Per 109 Hours) 8-pin SOIC (D) JEDEC low-K model FIT (Failures Per 109 Hours) 8-pin PDIP (P) JEDEC low-K model
Total Component FIT Rate 26 30 16 25
Die FIT Rate 16 7 7 4
Package FIT Rate 10 23 9 21

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 290 mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-4 Component Failure Rates per Siemens Norm SN 29500-2
TableCategoryReference FIT RateReference Virtual TJ
5 CMOS, BICMO
Digital analog / mixed		 25 FIT 55°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-4 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.