SFFS191C March   2022  – November 2025 UCC27200-Q1 , UCC27201A-Q1 , UCC27211A-Q1 , UCC27212A-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC PowerPAD Package
    2. 2.2 SOIC Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
  7. 5Revision History

2.1 SOIC PowerPAD Package

This section provides functional safety failure in time (FIT) rates for UCC27200-Q1, UCC27201A-Q1, UCC27211A-Q1, and UCC27212A-Q1 (SOIC PowerPAD™) based on two different industry-wide used reliability standards:

  • Table 2-3 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-4 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262 Power Dissipation (mW) FIT (Failures Per 109 Hours)
Total component FIT rate 50 10
550 13
Die FIT rate 50 3
550 5
Package FIT rate 50 7
550 8

The failure rate and mission profile information in Table 2-3 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission profile: Motor control from table 11 or figure 16
  • Power dissipation: 50mW, 550mW
  • Climate type: World-wide table 8 or figure 13
  • Package factor (lambda 3): Table 17b or figure 15
  • Substrate material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2
Table Category Reference FIT Rate Reference Virtual TJ
5 CMOS, BICMOS
Digital, analog, or mixed		 20 55

The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-4 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.