SFFS343 December   2021 TPS1HC100-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TPS1HC100-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the TPS1HC100-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TPS1HC100-Q1 data sheet.

Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • Follows data sheet recommendation for operating conditions, external components selection, and PCB layout
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
GND1Resistor/diode network is bypassed if presentB
EN 2 Shutdown of corresponding channel B
DIAG_EN 3 Diagnostics are disabled B
FAULT 4 Status being reported can be erroneous B
LATCH 5 Device defaults to auto-retry mode when encountering thermal fault B
SNS 6 Sense current not valid from SNS pin B
ILIM 7 Device defaults to internal open current limit C
NC8,11,14No effectD
VOUT9,10Current limit of device engagesB
VBB12,13Device has no input supply and therefore does not functionB
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
GND1Loss of ground detection engages and device shuts offB
EN 2 Corresponding channel is shutdown and EN is pulled down internally B
DIAG_EN 3 Internally pulled down. Diagnostics are disabled. B
FAULT 4 Fault signal not reported B
LATCH 13 Internally pulled down. Device defaults to auto-retry mode when encountering thermal fault B
SNS 10 Version B only. Correct sense current cannot be read. B
ILIM 11 Device defaults to internal current limit C
NC8,11,14No effectD
VOUT9,10No effect. If configured, open load detection triggersB
VBB12,13Device has no input supply and therefore does not functionB
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class
GND 1 EN Channel is disabled B
EN 2 DIAG_EN EN signal affects DIAG_EN signal and vice versa B
DIAG_EN 3 FAULT Fault reporting is erroneous. Diagnostics are enabled if FAULT is pulled high B
FAULT 4 LATCH Fault reporting is erroneous. Device is in auto-retry mode if FAULT is pulled high. B
LATCH 5 SNS Current sensing output is erroneous. Device is in auto-retry or latched off depending on the output of the SNS pin. B
SNS 6 ILIM Current limit and current sensing output is incorrect. B
NC 8 VOUT No effect D
VOUT 10 NC No effect D
NC 11 VBB No effect D
VBB 13 NC No effect D
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply (VBB)
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
GND1Supply power is bypassed and device does not turn onB
EN2Potential violation of absolute maximum rating of pin and possible breakdown of ESD cellA
DIAG_EN 3 Potential violation of absolute maximum rating of pin and possible breakdown of ESD cell A
FAULT4Version B only. Potential violation of absolute maximum rating of pin and possible breakdown of ESD cell.A
LATCH 5 Potential violation of absolute maximum rating of pin and possible breakdown of ESD cell A
SNS6Version B only. Potential violation of absolute maximum rating of pin and possible breakdown of ESD cellA
ILIM7Potential violation of absolute maximum rating of pin and possible breakdown of ESD cellA
NC 8,11,14 No effect D
VOUT9,10Output is pulled to supply voltage. Short-to-battery detection is triggered if configured.B