SFFS534 October   2022 TPSM365R3 , TPSM365R6

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TPSM365R6
    2. 2.2 TPSM365R3
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

1 Overview

This document contains information for TPSM365R6 and TPSM365R3 (VQFN-HR package) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

Figure 1-1 Functional Block Diagram

TPSM365R6 and TPSM365R3 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

ADVANCE INFORMATION for preproduction products; subject to change without notice.