SFFS542 October   2022 ISO1640-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 8-D Package
    2. 2.2 16-DW Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 ISO1640-Q1 in 8-D Package
    2. 4.2 ISO1640-Q1 in 16-DW Package

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the ISO1640-Q1 ( in 8-D and 16-DW packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in #GUID-59152F0C-E454-4A8E-8EBF-F57DDDD860F8/GUID-F0AD1A50-620E-4CFA-A6FD-923BE4F4DEE4.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • External pull-up resistor on both SDA1/SCL1 to VCC1, pull-up resistor on SDA2/SCL2 to VCC2