SFFS627 may   2023 INA310A-Q1 , INA310B-Q1

PRODUCTION DATA  

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the INA310-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to Supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the INA310-Q1 pin diagram. For a detailed description of the device pins, see the Pin Configuration and Functions section in the INA310-Q1 data sheet.

GUID-20230505-SS0I-P5HR-KLGZ-GFDHZMZFF9W6-low.svg Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • TA = -40°C to +125°C
  • VS = 5 V
  • IN+ = 48 V
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VS1Power supply shorted to ground.B
OUT2Output shorts to ground. When left in this configuration for a long time, under high supplies self heating could cause dice junction temperature to exceed 150 degrees Celsius.B
CMPIN3Comparator output is stuck low.B
GND4Normal operation.D
RESET5Comparator is in Transparant Mode. If intended connection is not GND or open, functionality will be affected.D if RESET=GND by design; B otherwise
CMPOUT6Comparator output is stuck low.B
IN-7In high-side configuration, a short from the bus supply to GND will occur. High current will flow from bus supply to ground. In low-side configuration, normal operation.B for high-side or D for low-side
IN+8In high-side configuration, a short from the bus supply to GND will occur. High current will flow from bus supply to ground. In low-side configuration, input pins are shorted.B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VS1No power supply to device. Device may be biased through inputs. Output will be close to GND.B
OUT2Output can be left open, there is no effect on the IC.B
CMPIN3Comparator input is not defined.B
GND4GND is floating. Output will be incorrect as it is no longer referenced to GND. B
RESET5Comparator is in Transparant Mode. If intended connection is not open or GND, functionality will be affected.D if RESET=open OR GND by design; B otherwise
CMPOUT6Pin can be left open if not needed.D if CMPOUT=open by design; B otherwise
IN-7Differential input voltage is not well defined.B
IN+8Differential input voltage is not well defined.B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure Effect(s)Failure Effect Class
VS1OUTOutput shorts to supply. When left in this configuration for a long time, under high supplies self heating could cause dice junction temperature to exceed 150 degrees Celsius.B
OUT2CMPINComaprator will be damaged if OUT is higher than the smaller of 5.5 V or VS.A if OUT is higher than the smaller of 5.5 V or VS; B otherwise
CMPIN3GNDComparator output is stuck low output is stuck low.B
GND4RESETComparator is in Transparant Mode. If intended connection is not GND or open, functionality will be affected.D if RESET=GND OR open by design; B otherwise
RESET5CMPOUTComparator output is unpredictable.B
CMPOUT6IN-In high-side configuration, CMPOUT tied to VBUS, which could exceed Abs Max ratings. Device could be damaged. In low-side configuration, CMPOUT output is stuck low.A for high-side or B for low-side
IN-7IN+Input differential voltage = 0 V.C
IN+8VSIn high-side configuration, a short from the bus supply to VS will occur. High current will flow from bus supply to VS or vice versa. Device could be damaged.A for high-side or B for low-side
Table 4-5 Pin FMA for Device Pins Short-Circuited to Supply
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VS 1 Normal operation. D
OUT 2 Output shorts to supply. When left in this configuration for a long time, under high supplies self heating could cause dice junction temperature to exceed 150 degrees Celsius. B
CMPIN 3 Comparator output is stuck high or unpredictable. B
GND 4 Power supply shorted to GND. B
RESET 5 Comparator is in Latch Mode. If intended connection is not VS, functionality will be affected. D if RESET=VS by design; B otherwise
CMPOUT 6 Comparator output is stuck high or unpredictable.. B
IN- 7 In high-side configuration, a short from the bus supply to VS will occur. High current will flow from bus supply to VS or vice versa. Device could be damaged. A for high-side or B for low-side
IN+ 8 In high-side configuration, a short from the bus supply to VS will occur. High current will flow from bus supply to VS or vice versa. Device could be damaged. A for high-side or B for low-side