SFFS809 September 2024 TLV710-Q1

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the TLV710-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Pin short-circuited to ground (see Table 4-2)
Pin open-circuited (see Table 4-3)
Pin short-circuited to an adjacent pin (see Table 4-4)
Pin short-circuited to VIN (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects

Class	Failure Effects
A	Potential device damage that affects functionality.
B	No device damage, but loss of functionality.
C	No device damage, but performance degradation.
D	No device damage, no impact to functionality or performance.

Figure 4-1 shows the TLV710-Q1 pin diagram. For a detailed description of the device pins, see the Pin Configuration and Functions section in the TLV710-Q1 data sheet.

Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

Device contains DSE pin configuration. Device operates at free-air temperatures between -40°C and 125°C.
Device operates at an input voltage less than 5.5V and more than 2V.
Device operates according to all recommended operating conditions and does not exceed the absolute maximum ratings.

Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground

Pin Name	Pin No.	Description of Potential Failure Effects	Failure Effect Class
EN1	1	LDO 1 is always off due to EN being grounded.	B
IN	2	Output voltage is at or near ground.	B
EN2	3	LDO 2 is always off due to EN being grounded.	B
GND	4	No effect. Normal operation.	D
OUT2	5	Output voltage 2 is at or near ground. Device is in current limit. The device can cycle in and out of thermal shutdown depending on power dissipation.	B
OUT1	6	Output voltage 1 is at or near ground. Device is in current limit. The device can cycle in and out of thermal shutdown depending on power dissipation.	B

Table 4-3 Pin FMA for Device Pins Open-Circuited

Pin Name	Pin No.	Description of Potential Failure Effects	Failure Effect Class
EN1	1	LDO is in unknown state.	B
IN	2	No input to LDO. Output is at or near ground.	B
EN2	3	LDO is in unknown state.	B
GND	4	There is no current loop for internal biasing; device cannot operate.	B
OUT2	5	Device 2 output is unregulated and the load is not powered.	B
OUT1	6	Device 1 output is unregulated and the load is not powered.	B

Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin

Pin Name	Pin No.	Shorted to	Description of Potential Failure Effects	Failure Effect Class
EN1	1	IN	If EN is positive voltage above the IN absolute maximum rating, IN can be damaged.	A
IN	2	EN2	If EN is positive voltage above the IN absolute maximum rating, IN can be damaged.	A
GND	4	OUT2	Output voltage is at or near ground. Device is in current limit. The device can cycle in and out of thermal shutdown depending on power dissipation.	B
OUT2	5	OUT1	Output voltage is driven to unknown voltage. High current drive between pins is possible leading to potential thermal shutdown.	A

Table 4-5 Pin FMA for Device Pins Short-Circuited to VIN

Pin Name	Pin No.	Description of Potential Failure Effects	Failure Effect Class
EN1	1	If EN is positive voltage above the IN absolute maximum rating, IN can be damaged.	A
IN	2	No effect. Normal operation.	D
EN2	3	If EN is positive voltage above the IN absolute maximum rating, IN can be damaged.	A
GND	4	Output voltage is at or near ground.	B
OUT2	5	Regulation for LDO 2 is not possible. The output voltage equals input voltage.	B
OUT1	6	Regulation for LDO 1 is not possible. The output voltage equals input voltage.	B