SFFSAC9A November   2025  – December 2025 CSD967201-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
  7. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the CSD967201. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (VIN and VDRV, or VCC) (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality.
BNo device damage, but loss of functionality.
CNo device damage, but performance degradation.
DNo device damage, no impact to functionality or performance.

Figure 4-1 shows the CSD967201 pin diagram. For a detailed description of the device pins, see the Pin Configuration and Functions section in the CSD967201 data sheet.

CSD967201 Pin Diagram (Top View) Figure 4-1 Pin Diagram (Top View)

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • The VIN and VDRV supplies are within the recommended operating conditions.
  • The external components on the pins are within the recommended passive component tolerance.
  • The board conditions are within the recommended board level parasitic tolerance.
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin No. Pin Name Description of Potential Failure Effects Failure Effect Class
1 BP33 The device does not allow PWM switching and remains in tri-state mode. B
2 AGND The device continues to operate, but the AGND pin potentially experiences more disturbance to the transient ground. The PWM and interface parametrical are potentially skewed. C
3 VCC The device remains in a POR state. The device does not power on and remains in reset. B
4 VDRV The device remains in a POR state. The device does not power on and remains in reset. B
5-10 PGND The device operates as normal with full functionality. D
19-22
35
37
11-18 SW The device is not functional and the power stage is not able to control VOUT. The peak current limit is used to limit the current of the high-side FET. The SW pin to ground causes the system regulation to drop to 0V. If there is a hard 0Ω short, there is potential damage to the internal high-side FET. A
23
38
24-29 VIN The device does not allow the power stage or IMON to function, and the device remains in a non-switching mode. B
30 PHASE The device is not functional and the power stage is not able to control VOUT. The peak current limit is used to limit the current of the high-side FET. The SW pin to ground causes the system regulation to drop to 0V. If there is a hard 0Ω short, there is potential damage to the internal high-side FET. A
31 BOOT The boot cap cannot charge, and the device does not have a floating supply for the boot domain. The boot UV detection does not allow the high-side FET to turn on, potentially causing a loss of regulation in the system. B
32 PWM There is a loss of functionality, with the low-side FET staying on after start-up. B
33 EN The device does not allow for PWM switching. A
34 TMON/FLT There is excessive current on the VDRV pin, with no TMON signal for all power stages in the system. B
36 IMON The controller sources large current from CSBIAS across the internal or external 1kΩ resistor in the system. Faults potentially do not trigger correctly. A
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin No. Pin Name Description of Potential Failure Effects Failure Effect Class
1 BP33 If no cap is connected, the LDO is unstable. The PWM is potentially falsely detected, and TMON potentially experiences small oscillations. C
2 AGND The device does not interpret the PWM signal correctly and potentially does not turn on. C
3 VCC The device remains in a POR state. The device does not power on and remains in reset. B
4 VDRV The device remains in a POR state. The device does not power on and remains in reset. B
5-10 PGND GND is still present due to multiple PGND pins. The full functionality of the device is maintained. D
19-22
35
37
11-18 SW The device is not functional and output regulation cannot be controlled by the power stage. B
23
38
24-29 VIN The device does not allow the power stage or IMON to function, and the device remains in a non-switching mode. B
30 PHASE The device is not functional, and output regulation cannot be controlled by the power stage. B
31 BOOT The boot cap cannot charge, and the device does not have a floating supply for the boot domain. The boot UV detection does not allow the high-side FET to turn on, potentially causing a loss of regulation in the system. B
32 PWM The device detects this pin as a PWM tri-state input and both the low-side and high-side FETs remain off. B
33 EN The device pulls down internally and does not allow the PWM input to turn the power stage on or off. B
34 TMON/FLT The TMON output does not report for the power stage. B
36 IMON The controller sources large current from CSBIAS across the internal or external 1kΩ resistor in the system. Faults potentially do not trigger correctly. A
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin No. Pin Name Shorted to Description of Potential Failure Effects Failure Effect Class
1 BP33 IMON Depending on the strength of the IMON drive, the BP33 pin is likely to dominate. The BP33 pin potentially rises to VCC. B
AGND The device does not allow PWM switching and remains in tri-state mode. B
2 AGND BP33 The device does not allow PWM switching and remains in tri-state mode. B
VCC The device remains in a POR state. The device does not power on and remains in reset. B
3 VCC AGND The device remains in a POR state. The device does not power on and remains in reset. B
VDRV The device functions. There is no filter between the VCC and VDRV pins. The system potentially has more jitter. C
4 VDRV VCC The device functions. There is no filter between the VCC and VDRV pins. The system potentially has more jitter. C
PGND The device remains in a POR state. The device does not power on and remains in reset. B
5-10 PGND VDRV The device remains in a POR state. The device does not power on and remains in reset. B
19-22 IMON The controller sources large current from CSBIAS across the internal or external 1kΩ resistor in the system. Faults potentially do not trigger correctly. A
35 TMON/FLT There is excessive current on the VDRV pin, with no TMON signal for all power stages in the system. B
37 VIN The device does not allow the power stage or IMON to function, and the device remains in a non-switching mode. B
SW The device is not functional and the power stage is not able to control VOUT. The peak current limit is used to limit the current of the high-side FET. The SW pin to ground causes the system regulation to drop to 0V. If there is a hard 0Ω short, there is potential damage to the internal high-side FET. A
11-18 SW PGND The device is not functional and the power stage is not able to control VOUT. The peak current limit is used to limit the current of the high-side FET. The SW pin to ground causes the system regulation to drop to 0V. If there is a hard 0Ω short, there is potential damage to the internal high-side FET. A
23
38 VIN This is equivalent to a high-side FET short. The high-side short protection turns on the low-side FET and potentially damages the FET. A
24-29 VIN SW This is equivalent to a high-side FET short. The high-side short protection turns on the low-side FET and potentially damages the FET. A
PHASE This is equivalent to a high-side FET short. The high-side short protection turns on the low-side FET and potentially damages the FET. A
30 PHASE VIN This is equivalent to a high-side FET short. The high-side short protection turns on the low-side FET and potentially damages the FET. A
BOOT The boot cap does not have a floating supply for the boot domain. The boot UV detection does not allow the high-side FET to turn on, potentially causing a loss of regulation in the system. B
31 BOOT PHASE The boot cap does not have a floating supply for the boot domain. The boot UV detection does not allow the high-side FET to turn on, potentially causing a loss of regulation in the system. B
PWM The boot cap does not have a floating supply for the boot domain. The boot UV detection does not allow the high-side FET to turn on, potentially causing a loss of regulation in the system. If the BOOT pin is higher than the VCC supply, damage can occur to the PWM input. B
32 PWM BOOT The boot cap does not have a floating supply for the boot domain. The boot UV detection does not allow the high-side FET to turn on, potentially causing a loss of regulation in the system. If the BOOT pin is higher than the VCC supply, damage can occur to the PWM input. B
EN If EN = VCC, the high-side FET remains on. B
33 EN PWM If EN = VCC, the high-side FET remains on. B
TMON/FLT There is a loss of TMON and FAULT detection. TMON does not function. B
34 TMON/FLT EN There is a loss of TMON and FAULT detection. TMON does not function. B
VIN There is damage to the internal, 5V-rated circuitry. If VIN > 8V, there is potential damage to the device. A
36 IMON VIN There is damage to the internal, 5V-rated circuitry. If VIN > 8V, there is potential damage to the device. A
BP33 The controller sinks large current from the BP33 pin across the internal or external 1kΩ resistor in the system. Faults potentially do not trigger correctly. A
Table 4-5 Pin FMA for Device Pins Short-Circuited to VIN
Pin No. Pin Name Description of Potential Failure Effects Failure Effect Class
1 BP33 There is damage to the internal, 5V-rated circuitry. If VIN > 8V, there is potential damage to the device. A
2 AGND The power supply is missing. The device does not power up, with a large uncontrolled VIN input current, which potentially causes damage to the device. A
3 VCC There is damage to the internal, 5V-rated circuitry. If VIN > 8V, there is potential damage to the device. A
4 VDRV There is damage to the internal, 5V-rated circuitry. If VIN > 8V, there is potential damage to the device. A
5-10 PGND The power supply is missing. The device does not power up, with a large uncontrolled VIN input current, which potentially causes damage to the device. A
19-22
35
37
11-18 SW There is potential damage to the low-side FET. The high-side short detection forces the low-side FET to turn on if EN = 1. A
23
38
30 PHASE There is potential damage to the low-side FET. The high-side short detection forces the low-side FET to turn on if EN = 1. A
31 BOOT There is potential damage to the low-side FET. The high-side short detection forces the low-side FET to turn on if EN = 1. A
32 PWM There is damage to the internal, 5V-rated circuitry. If VIN > 8V, there is potential damage to the device. A
33 EN There is damage to the internal, 5V-rated circuitry. If VIN > 8V, there is potential damage to the device. A
34 TMON/FLT There is damage to the internal, 5V-rated circuitry. If VIN > 8V, there is potential damage to the device. A
36 IMON There is damage to the internal, 5V-rated circuitry. If VIN > 8V, there is potential damage to the device. Faults potentially do not trigger correctly. A