SFFSAO6 August 2025 TLV709

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the TLV709 (DBV (5-pin SOT-23) and PK (3-Pin SOT-89) packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Pin short-circuited to ground (see Table 4-2 and Table 4-6)
Pin open-circuited (see Table 4-3 and Table 4-7)
Pin short-circuited to an adjacent pin (see Table 4-4 and Table 4-8)
Pin short-circuited to supply (see Table 4-5 and Table 4-9)

Table 4-2 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects

Class	Failure Effects
A	Potential device damage that affects functionality.
B	No device damage, but loss of functionality.
C	No device damage, but performance degradation.
D	No device damage, no impact to functionality or performance.

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

The device operates at free-air temperatures between -40°C and 150°C.
The ADJ/EN pin is driven from an external source.
The device operates at an input voltage of at least 3V and no more than 40V.
The device operates according to all recommended operating conditions, and the absolute maximum ratings in the device-specific data sheet are not exceeded.
The NC pins are floating.