SFFSAR4 December   2025 ISO6041

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DW-16 Wide-SOIC Package
    2. 2.2 DFP-16 Wide-SSOP Package
    3. 2.3 DBQ-16 SSOP Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 DW-16 Wide-SOIC, DFP-16 Wide-SSOP, and DBQ-16 SSOP Packages
  7. 5Revision History

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the ISO6041 (DW-16 Wide-SOIC, DFP-16 Wide-SSOP, and DBQ-16 SSOP packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios, see Table 4-2:

  • Pin short-circuited to ground
  • Pin open-circuited
  • Pin short-circuited to an adjacent pin
  • Pin short-circuited to supply

Table 4-2 also indicates how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
Class Failure Effects
A Potential device damage that affects functionality.
B No device damage, but loss of functionality.
C No device damage, but performance degradation.
D No device damage, no impact to functionality or performance.

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • For short-to-ground analysis, the ground referenced for the short is the ground on that side of the isolation barrier.
  • For short-to-supply analysis, the supply referenced for the short is the supply on that side of the isolation barrier.
  • The default output levels for the outputs of OUTx are:
    • High for: ISO6041H
    • Low for: ISO6041L