SLAAES2 December 2025 MSPM33C321A
Differences with device supply pins
MSPM33C32 requires 2 VDD/VSS supply pairs in all packages, however MSPM0Gx51x only requires 1 VDD/VSS supply pair in 48 and 64 pin packages. If a single PCB is required to support both MSPM33C32x and MSPM0Gx51x it is recommended to provision 0Ω resistor connections in the locations of the additional supply pins which can be selectively populated when MSPM33C32x is installed or selectively de-populated with MSPM0Gx51x is installed. This avoids directly connecting VDD to a non-supply pin (such as a normal GPIO pin) in the case where a design is migrated from MSPM33C32x to MSPM0Gx51x.
Package family | TI package code | Device Pin | MSPM0Gx051x connection requirement | MSPM33C32xx connection requirement | Migration action |
|---|---|---|---|---|---|
LQFP100 | PZ |
N/a |
|
None | |
| NFBGA100 | ZAW | ||||
| LQFP80 | PN | ||||
LQFP64 | PM | Pin 8 | General IO and analog input. Not recommended to be connected to VSS | Ground (VSS) connection | Ensure connection meets device specific requirement. If single PCB compatibility is required populate a 0ohm resistor to connect VSS to MSPM33C32xx or de-populate disconnect VSS from MSPM0Gx51x |
Pin 9 | General purpose IO. Not recommended to be connected to VDD | VDD connection | Ensure connection meets device specific requirement. If single PCB compatibility is required populate a 0ohm resistor to connect VSS to MSPM33C32xx or de-populate disconnect VDD from MSPM0Gx51x | ||
VQFN48 | RGZ | Pin 49 (PowerPad) | No connection. | VSS connection. | Ensure PowerPad is connected to low-impedance electrical ground and sufficient thermal heat sink. |
Pin 7 | VSS | General purpose IO | Ensure connection meets device specific requirement. If single PCB compatibility is required populate a 0ohm resistor to connect VSS to MSPM0Gx51x or de-populate disconncec VSS from MSPM33C32xx | ||
Pin 30 | General purpose IO | connection | Ensure connection meets device specific requirement. If single PCB compatibility is required populate a 0ohm resistor to connect VSS to MSPM33C32xx or de-populate disconnect VDD from MSPM0Gx51x | ||
Differences with VBAT supply pins
MSPM33C32xx features a seperate low-power domain which can power a real-time clock (RTC), tamper detection pins, and a small backup memory. This power domain must be powered through an external supply pin called VBAT. MSPM0Gx51x does not include this feature. If a single PCB is required to support both MSPM33C32x and MSPM0Gx51x it is recommended to provision 0Ω resistor connections in the locations of the VBAT supply pin which can be selectively populated when MSPM33C32x is installed or selectively de-populated with MSPM0Gx51x is installed. This avoids directly connecting a supply voltage to a non-supply pin in the case where a design is migrated from MSPM33C32x to MSPM0Gx51x.
Package family | TI package code | Device Pin | MSPM0Gx051x connection requirement | MSPM33C32xx connection requirement | Migration action |
|---|---|---|---|---|---|
LQFP100 | PZ | Pin 7 |
General purpose IO |
VBAT supply connection |
Ensure connection meets device specific requirement. If single PCB compatibility is required populate a 0ohm resistor to connect VBAT to MSPM33C32xx or de-populate disconnect VBAT from MSPM0Gx51x |
| NFBGA100 | ZAW | Pin A3 | |||
| LQFP80 | PN | Pin 7 | |||
LQFP64 | PM | Pin 39 | |||
VQFN48 | RGZ | Pin 5 |
Differences with VCORE capacitor
MSPM0Gx51x and MSPM33C32xx family of devices require a capacitor to be placed between the VCORE device pin and ground. MSPM0Gx51x requires a 470nF capacitor. MSPM33C32xx requires a 2.2uF capacitor. If a single PCB is required to support both MSPM0Gx51x and MSPM33C32xx ensure that the capacitor footprint selected can accommodate both capacitor values.
Package family | TI package code | Device Pin | MSPM0Gx051x connection requirement | MSPM33C32xx connection requirement | Migration action |
|---|---|---|---|---|---|
LQFP100 | PZ | Pin 100 |
470nF capacitor |
2.2uF capacitor |
Ensure correct capacitor value is populated. If single PCB compatibility is required ensure capacitor footprint can support both capacitor values |
| NFBGA100 | ZAW | Pin A1 | |||
| LQFP80 | PN | Pin 80 | |||
LQFP64 | PM | Pin 32 | |||
VQFN48 | RGZ | Pin 48 |
Differences with VREF connections
To use the integrated ADC in both MSPM0Gx51x and MSPM33C321 a reference voltage must be available in the system. The reference voltage may be sourced externally or from the internal VREF generator. MSPM0Gx51x allows software to select between VDD, internal VREF, or external VREF. MSPM33C32xx does not allow software to select the reference source during runtime. The voltage reference to the MSPM33C32xx must be connected correctly at the board level in one of the ways described below:
ADC uses internal voltage reference (software configurable as 1.4V or 2.5V). A 1uF capacitor must be connected between VREF+ and VREF-/GND.
ADC uses VDD as voltage reference. VDD must be external connected to the VREF+ device pin on the PCB. A 1uF capacitor must be connected between VREF+ and VREF-/GND.
ADC uses external voltage reference. Use a external decoupling capacitor recommended by the external reference.
Boundary scan
MSPM33C32xx family devices support JTAG boundary scan. MSPM0Gx15x family devices do not support boundary scan. If boundary scan is not used, not modifications are required.