SLASEO0B July   2018  – June 2021 DAC61416 , DAC71416 , DAC81416

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 8.3.1.1 DAC Transfer Function
        2. 8.3.1.2 DAC Register Structure
          1. 8.3.1.2.1 DAC Register Synchronous and Asynchronous Updates
          2. 8.3.1.2.2 Broadcast DAC Register
          3. 8.3.1.2.3 Clear DAC Operation
      2. 8.3.2 Internal Reference
      3. 8.3.3 Device Reset Options
        1. 8.3.3.1 Power-on-Reset (POR)
        2. 8.3.3.2 Hardware Reset
        3. 8.3.3.3 Software Reset
      4. 8.3.4 Thermal Protection
        1. 8.3.4.1 Analog Temperature Sensor: TEMPOUT Pin
        2. 8.3.4.2 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Toggle Mode
      2. 8.4.2 Differential Mode
      3. 8.4.3 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Stand-Alone Operation
        1. 8.5.1.1 Streaming Mode Operation
      2. 8.5.2 Daisy-Chain Operation
      3. 8.5.3 Frame Error Checking
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

11.1 Layout Guidelines

The pin configuration of the DACx1416 has been designed in such a way that the analog, digital, and power pins are spatially separated from each other, which makes the PCB layout simple. An example layout is shown in Figure 11-1. As evident, every power supply pin has a 0.1-µF capacitor close to the pin. Make sure to lay out the analog and digital signals away from each other, or on different PCB layers. Make sure to provide an unbroken reference plane (either ground or VIO) for the digital signals. The higher frequency signals, such as SCLK and SDI, must have appropriate impedance termination in order to address signal integrity.