SLAU877A October   2022  – November 2023

 

  1.   1
  2.    TRF0206-SP Evaluation Module
  3.   Trademarks
  4. 1Description
    1. 1.1 Features
    2. 1.2 General Usage Information
  5. 2EVM Overview
    1. 2.1 Schematic
    2. 2.2 PCB Layers
    3. 2.3 TRF0206-SP EVM Bill of Material
    4. 2.4 Stack-Up and Material
  6. 3Test Setup Diagrams
    1. 3.1 S-Parameter Test Setup
    2. 3.2 Noise Figure Test Setup
    3. 3.3 Two-Tone OIP3 Test Setup
  7. 4Related Documentation
  8. 5Revision History

2.4 Stack-Up and Material

The TRF0206-SP EVM is a 67-mil, 4-layer board whose material type is Isola® 185HR. The top layer routes the power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground layer. The signal trace impedance is targeted at 50 Ω. The bottom 3 layers are ground layers.

GUID-1EDF500A-C281-4076-B0A3-676B6524F6CC-low.svgFigure 2-6 TRF0206-SP EVM Stack-Up (Units in Mils)