SLLSFT3B November   2025  – November 2026 MC121-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Timing Requirements
    7. 5.7 Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Motor Control
        1. 6.3.1.1 Duty Input
        2. 6.3.1.2 Duty Curve
        3. 6.3.1.3 Motor Start, Speed Change, and Stop
        4. 6.3.1.4 Open-Loop (Duty Cycle) Control
        5. 6.3.1.5 Closed-Loop (Speed) Control
        6. 6.3.1.6 Commutation
          1. 6.3.1.6.1 Hall Sensor
            1. 6.3.1.6.1.1 Field Direction Definition
            2. 6.3.1.6.1.2 Internal Hall Latch Sensor Output
          2. 6.3.1.6.2 Hall Offset
          3. 6.3.1.6.3 Square Commutation
          4. 6.3.1.6.4 Soft Commutation
        7. 6.3.1.7 PWM Modulation Modes
      2. 6.3.2 Protections
        1. 6.3.2.1 Locked Rotor Protection
        2. 6.3.2.2 Current Limit
        3. 6.3.2.3 Overcurrent Protection (OCP)
        4. 6.3.2.4 VM Undervoltage Lockout (UVLO)
        5. 6.3.2.5 VM Over Voltage Protection (OVP)
        6. 6.3.2.6 Thermal Shutdown (TSD)
        7. 6.3.2.7 Integrated Supply (VM) Clamp
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active Mode
      2. 6.4.2 Sleep and Standby Mode
      3. 6.4.3 Fault Mode
      4. 6.4.4 Test Mode and One-Time Programmable Memory
    5. 6.5 Programming
      1. 6.5.1 I2C Communication
        1. 6.5.1.1 I2C Read
        2. 6.5.1.2 I2C Write
  8. 7 Register Map
    1. 7.1 USR_OTP Registers
    2. 7.2 USR_TM Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 External Components
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Bulk Capacitance
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
    5. 8.5 Hall Element Position
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision A (March 2025) to Revision B (November 2026)

  • Updated MC121QDEZRQ1 device status from Advanced Information to Production DataGo

Changes from Revision * (December 2025) to Revision A (March 2025)

  • Updated device status from Advanced Information to Production Data.Go