SLOA300A October   2021  – April 2022 TLC2272-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC (D) 8 Package
    2. 2.2 TSSOP (PW) 8 Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC (D) 8 Package
    2. 4.2 TSSOP (PW) 8 Package
  6. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TLC2272-Q1 (SOIC (D) 8 and TSSOP (PW) 8 package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • Short circuit to Supply or Power means short to VDD+

  • Short to GND means short to VDD–