SLOS094H November   1970  – February 2026 UA741

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics: μA741C
    5. 5.5 Electrical Characteristics: μA741Y
    6. 5.6 Switching Characteristics: μA741C
    7. 5.7 Switching Characteristics: μA741Y
    8. 5.8 Typical Characteristics
  7. 6 Application and Implementation
  8. 7 Power Supply Recommendations
  9. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Trademarks
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.3 Thermal Information

THERMAL METRIC(1)µA741UNIT
D (SOIC)P (PDIP)PS (SO)
8 PINS8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance138.787.4119.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance78.789.366°C/W
RθJBJunction-to-board thermal resistance82.264.470°C/W
ψJTJunction-to-top characterization parameter27.849.827.2°C/W
ψJBJunction-to-board characterization parameter81.464.169°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.