SLOS197B August   1997  – July 2025 TLV2721

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics VS = 3V
    5. 5.5 Electrical Characteristics VS = 5V
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving Large Capacitive Loads
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

3 Description

The TLV2721 is a single low-voltage operational amplifier available in the SOT-23 package. The TLV2721 offers a compromise between the ac performance and output drive of the TLV2731 and the micropower TLV2711. The device consumes only 150µA (max) of supply current and is an excellent choice for battery-powered applications. The device exhibits rail-to-rail output performance for increased dynamic range in single or split-supply applications.

The TLV2721 is fully characterized at 3V and 5V and is optimized for low-voltage applications. The TLV2721, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels combined with 3V operation, these devices work well in battery operated monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs).

With a total area of 5.6mm2, the SOT-23 package only requires one third the board space of the standard 8-pin SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal source, minimizing noise pick-up from long PCB traces.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
TLV2721 DBV (SOT-23, 5) 2.9mm × 2.8mm
(1) For all available packages, see Section 10.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
TLV2721 Difference Amplifier With RES11A-Q1 Difference Amplifier With RES11A-Q1