SLOS460B March   2005  – September 2025 LP2902 , LP324

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
  7. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)(2) LP2902, LP324 UNIT
D (SOIC) PW (TSSOP) N (PDIP)
14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 140 154 90 °C/W
(1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA) / θJA. Operating at the absolute maximum TJ of 150°C potentially affects reliability.