SLUS456G April   1999  – July 2025 UCC2808A-1 , UCC2808A-2 , UCC3808A-1 , UCC3808A-2

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Pin Descriptions
        1. 6.3.1.1 COMP
        2. 6.3.1.2 CS
        3. 6.3.1.3 FB
        4. 6.3.1.4 GND
        5. 6.3.1.5 OUTA and OUTB
        6. 6.3.1.6 RC
        7. 6.3.1.7 VDD
    4. 6.4 Device Functional Modes
      1. 6.4.1 VCC
      2. 6.4.2 Push-Pull or Half-Bridge Function
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) D (SOIC) PW (TSSOP) UNIT
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 118.7 157.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66 67.8 °C/W
RθJB Junction-to-board thermal resistance 63.5 97.4 °C/W
ψJT Junction-to-top characterization parameter 14.7 9.1 °C/W
ψJB Junction-to-board characterization parameter 62.5 95.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.