SLUS846D September   2008  – August 2024 UCC25600

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start
      2. 7.3.2 Overcurrent Protection
      3. 7.3.3 Gate Driver
      4. 7.3.4 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Burst-Mode Operation
      2. 7.4.2 VCC
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Principal of Operation
      2. 8.1.2 Adjustable Dead Time
      3. 8.1.3 Oscillator
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Support Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
  13. 12Glossary
  14. 13Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)UCC25600UNIT
D (SOIC)
8 PINS
RθJAJunction-to-ambient thermal resistance118.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance72.5°C/W
RθJBJunction-to-board thermal resistance58.9°C/W
ψJTJunction-to-top characterization parameter24.1°C/W
ψJBJunction-to-board characterization parameter58.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.