SLUU254A December 2006 – January 2022 TPS40075
- Trademarks
- 1Introduction
- 2TPS40075EVM-001 Electrical Performance Specifications
- 3Schematic
- 4Test Setup
- 5TPS40075EVM Typical Performance Data and Characteristic Curves
- 6EVM Assembly Drawings and Layout
- 7List of Materials
- 8Revision History
6 EVM Assembly Drawings and Layout
Figure 6-1 through Figure 6-6 show the design of the TPS40075EVM-001 printed circuit board. The EVM has been designed using a 4-layer, 2-oz. copper-clad circuit board 3.0 inch × 3.0 inch with all components on the top side to allow the user to easily view, probe, and evaluate the TPS40075 control device in a practical application. Moving components to both sides of the PCB or using additional internal layers can offer additional size reduction for space constrained systems.
Figure 6-1 TPS40075EVM-001 Component Placement (Viewed from Top)
Figure 6-2 TPS40075EVM-001 Silkscreen (Viewed from Top)
Figure 6-3 TPS40075EVM-001 Top Copper (Viewed from Top)
Figure 6-4 TPS40075EVM-001 Layer 2 (X-Ray View from Top)
Figure 6-5 TPS40075EVM-001 Layer 3 (X-Ray View from Top)
Figure 6-6 TPS40075EVM-001 Bottom Copper (X-Ray View from Top)