SLUUD24 May   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 General Description
    2. 2.2 Definitions
    3. 2.3 Equipment
    4. 2.4 Equipment Setup
    5. 2.5 Procedure
      1. 2.5.1 Charge Function
      2. 2.5.2 OTG Function
  9. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials
  10. 4Additional Information
    1. 4.1 Trademarks

PCB Layout

Figure 4-2 through Figure 4-9 illustrate the board assembly and layout images.

BQ25770GEVM, BQ25773GEVM Top
                    Assembly Figure 3-2 Top Assembly
BQ25770GEVM, BQ25773GEVM Bottom
                    Assembly Figure 3-3 Bottom Assembly
BQ25770GEVM, BQ25773GEVM PCB Layer 1 Figure 3-4 PCB Layer 1
BQ25770GEVM, BQ25773GEVM PCB Layer 2 (Negative) Figure 3-5 PCB Layer 2 (Negative)
BQ25770GEVM, BQ25773GEVM PCB Layer 3 Figure 3-6 PCB Layer 3
BQ25770GEVM, BQ25773GEVM PCB Layer 4 Figure 3-7 PCB Layer 4
BQ25770GEVM, BQ25773GEVM PCB Layer 5 (Negative) Figure 3-8 PCB Layer 5 (Negative)
BQ25770GEVM, BQ25773GEVM PCB Layer 6 Figure 3-9 PCB Layer 6