SLVSCJ0F March   2014  – July 2025 TPS25200

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Thermal Sense
      3. 7.3.3 Overcurrent Protection
      4. 7.3.4 FAULT Response
      5. 7.3.5 Output Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Undervoltage Lockout (UVLO)
      2. 7.4.2 Overcurrent Protection (OCP)
      3. 7.4.3 Overvoltage Clamp (OVC)
      4. 7.4.4 Overvoltage Lockout (OVLO)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Step by Step Design Produce
        2. 8.2.2.2 Input and Output Capacitance
        3. 8.2.2.3 Programming the Current-Limit Threshold
        4. 8.2.2.4 Design Above a Minimum Current Limit
        5. 8.2.2.5 Design Below a Maximum Current Limit
        6. 8.2.2.6 Power Dissipation and Junction Temperature
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)TPS25200UNIT
DRV (WSON)
6 PINS
θJAJunction-to-ambient thermal resistance66.5°C/W
θJCtopJunction-to-case (top) thermal resistance83.4°C/W
θJBJunction-to-board thermal resistance36.1°C/W
ψJTJunction-to-top characterization parameter1.6°C/W
ψJBJunction-to-board characterization parameter36.5°C/W
θJCbotJunction-to-case (bottom) thermal resistance7.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.