SLVSEN8C July   2018  – June 2025 ESD321

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings – JEDEC Specifications
    3. 5.3 ESD Ratings – IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Signal Range
        2. 7.2.2.2 Operating Frequency
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision B (October 2023) to Revision C (June 2025)

  • Separated pinout information into two tablesGo

Changes from Revision A (December 2022) to Revision B (October 2023)

  • Updated the Package Information table to include package sizeGo
  • Changed voltage to power in the Surge Curve (IEC 61000-4-5, tp=8/20µs), I/O Pin to GND figureGo

Changes from Revision * (July 2018) to Revision A (December 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the DYA package to the data sheetGo