SLVSGG6D April   2022  – September 2026 TPS25981

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
      1.      15
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO and UVP)
      2. 7.3.2 Overvoltage Lockout (OVLO)
      3. 7.3.3 Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 7.3.3.1 Slew Rate (dVdt) and Inrush Current Control
        2. 7.3.3.2 Circuit-Breaker During Steady-State
        3. 7.3.3.3 Active Current Limiting During Start-Up
        4. 7.3.3.4 Short-Circuit Protection
      4. 7.3.4 Analog Load Current Monitor
      5. 7.3.5 Overtemperature Protection (OTP)
      6. 7.3.6 Fault Response and Indication (FLT)
      7. 7.3.7 Power Good Indication (PG)
      8. 7.3.8 Quick Output Discharge (QOD)
      9. 7.3.9 Reverse Current Blocking FET Driver
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Single Device, Self-Controlled
        1. 8.1.1.1 Other Variations
      2. 8.1.2 Parallel Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Device Selection
        2. 8.2.2.2 Setting Output Voltage Rise Time (tR)
        3. 8.2.2.3 Setting Overcurrent Threshold (ILIM)
        4. 8.2.2.4 Setting Overcurrent Blanking Interval (tITIMER)
        5. 8.2.2.5 Voltage Drop
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Transient Protection
      2. 8.3.2 Output Short-Circuit Measurements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

7.3.5 Overtemperature Protection (OTP)

The device monitors the internal die temperature (TJ) at all times and shuts down the part as soon as the temperature exceeds a safe operating level (TSD) thereby protecting the device from damage. The device does turn back on until the junction cools down sufficiently, that is the die temperature falls below (TSD – TSDHYS).

When the TPS25981xL (latch-off variant) detects thermal overload, it is shut down and remains latched-off until the device is power cycled or re-enabled. When the TPS25981xA (auto-retry variant) detects thermal overload, it remains off until it has cooled down by TSDHYS. Thereafter, the device remains off for an additional delay of tRST after which it automatically retries to turn on if it is still enabled.

Table 7-1 Thermal Shutdown
DeviceEnter TSDExit TSD
TPS25981xL (latch-off)TJ ≥ TSDTJ < TSD – TSDHYS

VIN cycled to 0 V and then above VUVP(R) or EN/UVLO toggled below VSD(F)

TPS25981xA (auto-retry)TJ ≥ TSDTJ < TSD – TSDHYS

VIN cycled to 0V and then above VUVP(R) or EN/UVLO toggled below VSD(F) or tRST timer expired