SLVSH27B April   2023  – December 2025 ESD451

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings—JEDEC Specification
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

1 Features

  • IEC 61000-4-2 level 4 ESD protection:
    • ±30kV contact discharge
    • ±30kV air gap discharge
  • IEC 61000-4-5 surge protection:
    • 6A (8/20µs)
  • IO capacitance:
    • 0.5pF (typical)
  • DC breakdown voltage: ±8V (typical)
  • Ultra low leakage current: 50nA (maximum)
  • Extremely low ESD clamping voltage
    • 10.4V at 16A TLP
    • RDYN: 0.19Ω
  • Low insertion loss: 3.5GHz (-3dB bandwidth)
  • Supports high speed interfaces up to 6Gbps
  • Industrial temperature range: –55°C to +150°C
  • Space saving industry standard 0201 (0.6mm x 0.3mm) and 0402 footprint (1.0mm x 0.6mm)