SLVSK21A October   2025  – September 2026 LMG708B0

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device and Documentation Support
    1. 4.1 Device Support
      1. 4.1.1 Development Support
        1. 4.1.1.1 Custom Design With WEBENCH® Tools
    2. 4.2 Documentation Support
      1. 4.2.1 Related Documentation
        1. 4.2.1.1 Low-EMI Design Resources
        2. 4.2.1.2 Thermal Design Resources
        3. 4.2.1.3 PCB Layout Resources
    3. 4.3 Receiving Notification of Documentation Updates
    4. 4.4 Support Resources
    5. 4.5 Trademarks
    6. 4.6 Electrostatic Discharge Caution
    7. 4.7 Glossary
  6. 5Revision History
  7. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Tape and Reel Information

4.5 Trademarks

PowerPAD™ and TI E2E™ are trademarks of Texas Instruments Incorporated.

WEBENCH® is a registered trademark of Texas Instruments Incorporated.

All trademarks are the property of their respective owners.