SLVSK21 October   2025 LMG708B0

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device and Documentation Support
    1. 4.1 Device Support
      1. 4.1.1 Development Support
        1. 4.1.1.1 Custom Design With WEBENCH® Tools
    2. 4.2 Documentation Support
      1. 4.2.1 Related Documentation
        1. 4.2.1.1 Low-EMI Design Resources
        2. 4.2.1.2 Thermal Design Resources
        3. 4.2.1.3 PCB Layout Resources
    3. 4.3 Receiving Notification of Documentation Updates
    4. 4.4 Support Resources
    5. 4.5 Trademarks
    6. 4.6 Electrostatic Discharge Caution
    7. 4.7 Glossary
  6. 5Mechanical, Packaging, and Orderable Information
    1. 5.1 Tape and Reel Information

4.5 Trademarks

PowerPAD™ and TI E2E™ are trademarks of Texas Instruments.

WEBENCH® is a registered trademark of Texas Instruments.

is a registered trademark of Texas Instruments.

All trademarks are the property of their respective owners.